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Mobile Phone Patent Abstract
An electromagnetic (EM) wave shield device including an upper pad
including a central hole and a bottom adhesive surface, a lower
pad including a central hole, a top adhesive surface, and a bottom
adhesive surface glued to the earpiece of a mobile phone, and a
metal mesh for shielding EM waves having a diameter smaller than
pads, while larger than that of central holes so as to be glued
and secured between pads. With this, when an incoming call is received,
there is no or little EM waves outside the glued shield device to
thereby prevent the brain of a mobile phone user from being hurt
by EM waves.
Mobile Phone Patent Claims
What is claimed is:
1. An electromagnetic (EM) wave shield device for a mobile phone
comprising:
an upper pad including a central hole for facilitating sound waves
to pass through, a top annular surface, and a bottom annular adhesive
surface;
a lower pad including a central hole corresponding to the central
hole of the upper pad, a top annular adhesive surface, and a bottom
annular adhesive surface glued to an earpiece of the mobile phone;
and
a metal mesh for shielding EM waves having a diameter smaller than
the upper and the lower pads, while having a diameter larger than
that of both the central holes of the upper and the lower pads so
as to be glued and secured between the upper and the lower pads;
whereby EM waves outside the glued shield device are substantially
absorbed or shielded when an incoming call is received.
2. The EM wave shield device of claim 1, further comprising a wave
absorption member provided between the metal mesh and the lower
pad.
3. The EM wave shield device of claim 2, wherein the wave absorption
member comprises a central hole.
4. The EM wave shield device of claim 2, wherein the wave absorption
member further comprises a plurality of small holes provided around
a central portion thereof.
5. The EM wave shield device of claim 1, wherein the upper pad
further comprises the central hole having a diameter smaller than
the central hole of the lower pad and two small holes beside thereof.
6. The EM wave shield device of claim 1, wherein the top annular
surface is made of an electroluminescent material for emitting light
in a dark environment.
7. The EM wave shield device of claim 1, wherein the top annular
surface of the upper pad is made of a predetermined material sensitive
to temperature so as to change the color of the top annular surface
when a predetermined time of contact of the top annular surface
with a human being is reached.
Mobile Phone Patent Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to mobile phones and more particularly
to an electromagnetic wave shield pad adhered to the earpiece of
mobile phone.
2. Description of Related Art
Mobile phones have been popular worldwide recently. It is a very
convenient portable communication means. However, there are a number
of drawbacks discovered in recent years associated with mobile phone.
For example, there is a great concern about whether electromagnetic
(EM) waves emitted from earpiece in response to an incoming call
may threaten the health of the person who answers the call in this
case. This concern is generally based on a plurality of medical
reports, which state that brain of a frequent mobile phone user
may be hurt. This is because ear always contact or near the earpiece
in order to hear the incoming call clearly, while EM waves near
the earpiece is the strongest in such a case. As a result, brain
maybe hurt.
Thus, it is desirable to provide a novel EM wave shield device
for mobile phone in order to provide a sufficient protection to
the brain of mobile phone user.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an electromagnetic
(EM) wave shield device having an absorption of metal mesh to prevent
the brain of a mobile phone user from being hurt by the direct emission
of EM wave from earpiece when an incoming call is received.
It is another object of the present invention to provide an EM
wave shield device glued to the earpiece of a mobile phone in which
the shield device further comprises a wave absorption member provided
between metal mesh and lower pad for enhancing the EM waves absorption
capability.
It is a further object of the present invention to provide an EM
wave shield device glued to the earpiece of a mobile phone wherein
advertising or any of other pretty patterns is printed on the top
annular surface for calling the public's attention.
To attain the purposes and features mentioned above, the shield
device of the present invention comprises an upper pad including
a central hole for facilitating sound waves to pass through, a smooth
top annular surface, and a bottom annular adhesive surface; a lower
pad including a central hole corresponding to the central hole of
upper pad, a top annular adhesive surface, and a bottom annular
adhesive surface glued to the earpiece of a mobile phone; and a
metal mesh for shielding EM waves having a diameter smaller than
pads, while larger than that of central holes so as to be glued
and secured between pads. With this, there is no or little EM waves
outside the glued shield device when an incoming call is received
due to the absorption of metal mesh, resulting in a prevention of
the brain of a mobile phone user from being hurt by the direct emission
of EM waves from earpiece.
The above and other objects, features and advantages of the present
invention will become apparent from the following detailed description
taken with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a first preferred embodiment of
electromagnetic wave shield pad for mobile phone according to the
invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a cross-sectional view of FIG. 1;
FIG. 4 is an exploded view of a second preferred embodiment of
electromagnetic wave shield pad for mobile phone according to the
invention;
FIG. 5 is a cross-sectional view of FIG. 4;
FIG. 6 is an environmental view showing the pad being mounted to
mobile phone;
FIG. 7 is similar to FIG. 6 where the pad adhered to earpiece of
mobile phone;
FIG. 8 is a perspective view of a third preferred embodiment of
electromagnetic wave shield pad for mobile phone according to the
invention wherein upper pad has a plurality of holes;
FIG. 9 is a perspective view of a fourth preferred embodiment of
electromagnetic wave shield pad for mobile phone according to the
invention wherein wave absorption member has multiple holes; and
FIG. 10 is cross-sectional view of FIG. 9.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIGS. 1 to 3, there is shown an electromagnetic (EM)
wave shield device for mobile phone constructed in accordance with
the invention. The device comprises an upper pad 10, a lower pad
20, and a metal mesh 30. Each of above component is detailed below.
Upper pad 10 comprises a central hole 11 for facilitating sound
waves to pass through, a smooth top annular surface 12 with advertising
or any of other pretty patterns printed thereon, the top annular
surface 12 being made of electro luminescent material in one embodiment
for emitting light in a dark environment or made of color-changing
material sensitive to the variation of temperature in the other
embodiment so as to change color for reminding user to cut short
of talk when a sufficient time of contact with ear is reached, and
a bottom annular adhesive surface 14.
Lower pad 20 is about the same shape and size as upper pad 10.
Lower pad 20 comprises a central hole 21 corresponding to central
hole 11 for facilitating sound waves to pass through, a top annular
adhesive surface 22 corresponding to the bottom annular surface
14, and a bottom annular adhesive surface 24. This bottom annular
adhesive surface 24 has the feature of quick fastening/unfastening
to earpiece of mobile phone.
The circular metal mesh 30 has the feature of shielding EM waves.
Metal mesh 30 has a diameter smaller than pads 20 and 40, while
larger than that of holes 11 and 21 so as to be glued and secured
between upper and lower pads 10 and 20.
Referring to FIGS. 4 and 5, there is shown a second preferred embodiment
of the invention. There is a wave absorption member 40 additionally
provided between metal mesh 30 and lower pad 20. Wave absorption
member 40 is an annular member having a central hole 41 larger than
other two central holes 11 and 21 beside thereof for facilitating
sound waves to pass through. Wave absorption member 40 is made of
magnetic metal powder capable of absorbing EM waves emitted by mobile
phone.
Referring to FIGS. 6 and 7, the mounting of the shield device of
the invention to mobile phone is illustrated. It is seen that bottom
annular adhesive surface 24 of lower pad 20 is glued to earpiece
51 of mobile phone 50. As such, there is no or little EM waves outside
the glued shield device when an incoming call is received due to
the absorption of metal mesh 30 and wave absorption member 40. As
a result, the brain of a mobile phone user may not hurt by the direct
emission of EM waves from earpiece 51.
Referring to FIG. 8, there is shown a third embodiment of the invention
wherein upper pad 10 has a main central hole 11a and two smaller
holes 11b and 11c for facilitating sound waves to pass through.
Referring to FIGS. 9 and 10, there is shown a fourth embodiment
of the invention wherein wave absorption member 40 has a plurality
of holes 42 in the central area.
While the invention herein disclosed has been described by means
of specific embodiments, numerous modifications and variations could
be made thereto by those skilled in the art without departing from
the scope and spirit of the invention set forth in the claims.
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