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Mobile Phone Patent Abstract
A method and system for determining mobile phone strain is provided.
The method includes the steps of determining if strain on a mobile
phone housing and/or strain on a printed circuit board (PCB) within
the mobile phone exceed a predetermined value. If the strain(s)
values exceed the predetermined value an alarm may be sounded and
the strain values may be stored in memory for later retrieval and/or
analysis.
Mobile Phone Patent Claims
What is claimed is:
1. A strain indicator system for indicating mechanical strain in
a communications device having a housing, the strain indicator system
comprising: at least one housing strain indicator, wherein the at
least one housing strain indicator is mechanically coupled to the
housing; at least one first electric circuit coupled to the at least
one housing strain indicator for determining housing strain; at
least one first alarm device coupled to the at least one first electric
circuit, wherein the strain indicator system is adapted to automatically
emanate a human perceivable sensory signal from the communications
device when the housing is subjected to an unintentional strain
beyond a predetermined undesired strain threshold.
2. A strain indicator system as in claim 1 wherein the at least
one first electric circuit comprises a first buffer-amplifier circuit.
3. A strain indicator system as in claim 1 wherein the at least
one first alarm device comprises a first light adapted to signal
housing strain exceeding a predetermined value.
4. A strain indicator system as in claim 1 wherein the at least
one first alarm device comprises a first sound alarm adapted to
signal housing strain exceeding a predetermined value.
5. A strain indicator system as in claim 1 wherein the at least
one first alarm device comprises a vibrator for vibrating the housing.
6. A strain indicator system as in claim 1 wherein the at least
one housing strain indicator mechanically coupled to the housing
comprises the at least one housing strain indicator epoxy bonded
to the housing.
7. A strain indicator system as in claim 1 wherein the at least
one housing cell strain indicator mechanically coupled to the housing
comprises the at least one housing strain indicator fabricated within
the housing.
8. A strain indicator system as in claim 1 further comprising a
memory for storing the housing strain determined by the first electric
circuit.
9. A strain indicator system as in claim 1 further comprising:
at least one printed circuit board (PCB); at least one PCB strain
indicator, the at least one PCB strain indicator mechanically coupled
to the PCB; at least one second electric circuit coupled to the
at least one PCB strain indicator for determining PCB strain, wherein
the at least one second electric circuit is coupled to the at least
one first alarm device.
10. A strain indicator system as in claim 1 wherein the at least
one housing strain indicator comprises at least one first resistive
strain gauge.
11. A strain indicator system as in claim 10 wherein the at least
one first resistive strain gauge comprises at least one element
of a first Wheatstone bridge.
12. A strain indicator system as in claim 1 wherein the at least
one housing cell strain indicator comprises at least one first piezo-electric
crystal.
13. A strain indicator system as in claim 12 wherein the at least
one first piezo-electric crystal comprises at least one first rectangular
shaped piezo-electric crystal.
14. A strain indicator system as in claim 12 wherein the at least
one first piezo-electric crystal comprises at least one first circular
shaped piezo-electric crystal.
15. A strain indicator system for indicating mechanical strain
in a communications device having a housing, the strain indicator
system comprising: at least one housing strain indicator, wherein
the at least one housing strain indicator is mechanically coupled
to the housing; at least one first electric circuit coupled to the
at least one housing strain indicator for determining housing strain;
at least one first alarm device coupled to the at least one first
electric circuit; at least one printed circuit board (PCB); at least
one PCB strain indicator, the at least one PCB strain indicator
mechanically coupled to the PCB; at least one second electric circuit
coupled to the at least one PCB strain indicator for determining
PCB strain; at least one second alarm device coupled to the at least
one second electric circuit.
16. A strain indicator system as in claim 15 wherein the at least
one second electric circuit comprises a second buffer-amplifier
circuit.
17. A strain indicator system as in claim 15 wherein the at least
one second alarm device comprises a second light adapted to signal
PCB strain exceeding a predetermined value.
18. A strain indicator system as in claim 15 wherein the at least
one second alarm device comprises a sound alarm adapted to signal
PCB strain exceeding a predetermined value.
19. A strain indicator system as in claim 15 wherein the at least
one second alarm device comprises a first vibrator for vibrating
the housing.
20. A strain indicator system as in claim 15 wherein the at least
one PCB strain indicator mechanically coupled to the PCB comprises
the at least one PCB strain indicator epoxy bonded to the PCB.
21. A strain indicator system as in claim 15 wherein the at least
one PCB strain indicator mechanically coupled to the housing comprises
the at least one PCB strain indicator fabricated within the PCB.
22. A strain indicator system as in claim 15 further comprising
a memory for storing the housing strain determined by the second
electric circuit.
23. A strain indicator system as in claim 15 wherein the at least
one PCB strain indicator comprises at least one second resistive
strain gauge.
24. A strain indicator system as in claim 23 wherein the at least
one second resistive strain gauge comprises at least one element
of a second Wheatstone bridge.
25. A strain indicator system as in claim 15 wherein the at least
one PCB strain indicator comprises at least one second piezo-electric
crystal.
26. A strain indicator system as in claim 25 wherein the at least
one second piezo-electric crystal comprises at least one second
rectangular shaped piezo-electric crystal.
27. A strain indicator system as in claim 25 wherein the at least
one second piezo-electric crystal comprises at least one second
circular shaped piezo-electric crystal.
28. A strain sensing system for sensing strain within a mobile
phone, the strain system comprising: at least one housing strain
indicator, the housing strain indicator mechanically coupled to
a mobile phone housing, wherein the at least one housing strain
indicator is adapted to sense strain of the housing; and at least
one printed circuit board (PCB) strain indicator, wherein the PCB
strain indicator is mechanically coupled to at least one PCB, wherein
the PCB strain indicator is adapted to sense strain of the PCB,
and wherein the at least one PCB is adapted to fit within the mobile
phone housing.
29. A strain sensing system as in claim 28 wherein the at least
one housing strain indicator comprises at least one first resistive
strain gauge.
30. A strain sensing system as in claim 28 wherein the at least
one housing strain indicator comprises at least one first piezo-electric
crystal.
31. A strain sensing system as in claim 28 wherein the at least
one PCB strain indicator comprises at least one second resistive
strain gauge.
32. A strain sensing system as in claim 28 wherein the at least
one PCB strain indicator comprises at least one second piezo-electric
crystal.
33. A strain sensing system as in claim 28 further comprising a
first strain circuit configuration, wherein the first strain configuration
comprises: at least one of the at least one housing strain indicator;
and at least one of the at least one PCB strain indicator.
34. A strain sensing system as in claim 33 wherein the first strain
circuit configuration comprises a Wheatetone bridge circuit configuration.
35. A method for determining mobile phone strain, the method comprising
the steps of: determining at least one unintentional phone housing
strain; and sounding an alarm if the at least one unintentional
phone housing strain exceeds a predetermined undesired strain value.
36. A method as in claim 35, wherein the step of determining mobile
phone strain further comprises the steps of: determining at least
one printed circuit board (PCB) strain; and sounding an alarm if
the at least one PCB strain exceeds a PCB predetermined undesired
strain value.
37. A method as in claim 36 wherein the step of sounding the alarm
comprises sounding a tone proportionate relative to a sensed strain.
Mobile Phone Patent Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to radio telephones and
radio telephone systems and, in particular, but not limited to,
radio telephones, and mobile radio communication systems and networks.
2. Prior Art
Modern mobile phones are often placed in situations where they
are subjected to a variety of forces that may bend, twist, or otherwise
distort the mobile phone case, and/or its internal circuitry systems
past a failure point. Such situations may arise from a user sitting
on the mobile phone, a mobile phone being crammed into an already
over filled briefcase or satchel, or the mobile phone being dropped.
Distorting the mobile phone may result in cracked housings and/or
internal circuitry that is rendered inoperable. In many cases it
may be difficult for a manufacturer to readily determine if an inoperable
circuit board is defective due to manufacturing defects or due to
user misuse. Therefore, it is desirable to provide a method and
system for a mobile phone that overcomes the disadvantages noted
above.
SUMMARY OF THE INVENTION
In accordance with one embodiment of the present invention a strain
indicator system for indicating mechanical strain in a communications
device is provided.
The strain indicator system includes a mobile phone housing strain
indicator that is mechanically coupled to the housing and an electric
circuit coupled to the housing strain indicator for determining
housing strain. In addition, at least one strain alarm device is
coupled to the electric circuit for sounding an alarm if the electric
circuit determines housing strain exceeds a predetermined value.
In accordance with another embodiment of the present invention
a strain sensing system for sensing strain within a mobile phone
is provided. The strain system includes a housing strain indicator
mechanically coupled to the mobile phone housing; and a printed
circuit board (PCB) strain indicator. The PCB strain indicator is
mechanically coupled to a PCB adapted to fit within the mobile phone.
The invention is also directed towards a method for determining
mobile phone strain. The method includes the steps of determining
mobile phone housing strain and sounding an alarm if mobile phone
housing strain exceeds a predetermined value. The method also includes
steps for determining and sounding an appropriate alarm if strain
on a printed circuit board (PCB) within the mobile phone exceeds,
or is about to exceed, a predetermined threshold value. The method
also includes steps for storing strain values for later retrieval
and analysis.
In accordance with another embodiment of the present invention
a strain indicator system for indicating mechanical strain in a
printed circuit board (PCB) is provided. The strain indicator system
includes at least one PCB strain indicator coupled to the PCB and
at least one electric circuit coupled to PCB strain indicator(s).
Coupled to the electric circuit is at least one alarm device, such
as a light and/or a speaker for indicating when PCB strain is about
to exceed, or has exceeded, a predetermined threshold.
BRIEF DESCRIPTION OF THE DRAWINGS
The foregoing aspects and other features of the present invention
are explained in the following description, taken in connection
with the accompanying drawings, wherein:
FIG. 1 is a perspective view of a mobile station incorporating
features of the present invention;
FIG. 2 is a block diagram of the mobile station shown in FIG. 1
that is constructed and operated in accordance with one embodiment
of this invention;
FIG. 3 is a perspective view of an alternate embodiment of a mobile
station incorporating features of the present invention;
FIG. 4 is a schematic diagram of one component of the embodiment
of the present invention shown in FIG. 2;
FIG. 5 is a pictorial diagram of a printed circuit board incorporating
features of the present invention; and
FIGS. 6A and 6B are flow diagrams showing alternate method steps
for implementing features of the present invention shown in FIG.
1.
DETAILED DESCRIPTION
Although the present invention will be described with reference
to the embodiments shown in the drawings, it should be understood
that the present invention could be embodied in many alternate forms
of embodiments.
FIGS. 1 and 2 are shown for illustrating a wireless user terminal
or mobile station (MS) 10, such as but not limited to a radiotelephone
or a personal communicator, which is suitable for practicing this
invention.
Referring to FIG. 1, the MS 10 includes an antenna 12 for receiving
signals from a base site or base station 30, which is assumed to
include a base station sub-system (BSS) as well as a base transceiver
station (BTS). For simplicity, these two components are collectively
referred to simply as the base station 30.
A user interface of the MS 10 connectable to a communications network
may include a conventional earphone or speaker 17, a conventional
microphone 19, a display 20, and a user input device, typically
a keypad 22, all of which are coupled to the controller 18. The
keypad 22 includes the conventional numeric (0 9) and related keys
(#,*) 22a, and other keys 22b used for operating the mobile station
10. These other keys 22b may include, by example, a SEND key, various
menu scrolling and soft keys, and a PWR key. The mobile station
10 also includes a battery 26 for powering the various circuits
that are required to operate the mobile station. In addition, the
various circuits may be contained within one or more printed circuit
boards (PCBs). The MS 10 also includes various memories, shown collectively
as the memory 24, wherein are stored a plurality of constants and
variables that are used by the controller 18 during the operation
of the MS.
The MS 10 also includes a modulator (MOD) 14A, a transmitter 14,
a receiver 16, a demodulator (DEMOD) 16A, and a controller 18 that
provides signals to and receives signals from the transmitter 14
and receiver 16, respectively.
Still referring to FIG. 1, one embodiment of the present invention
the mobile station housing 10A may include a body strain indicator
107. The strain indicator 107 may be any suitable strain indicator
such as a pattern of resistive foil mounted on a backing material
and epoxy bonded (or mechanically coupled) to the mobile station
housing 10A, or a piezo-electric crystal epoxy bonded (or mechanically
coupled) to the mobile station housing 10A. The piezo-electric crystal
may be any suitable shape such, as rectangular or circular, and
mounted to the housing to maximize strain detection along a sensitive
axis of the piezo-electric crystal.
In alternate embodiments, the strain indicator may be fabricated
within the body of the mobile phone housing during the manufacture
process (see FIG. 5). For example, thin film strain gauge layering
techniques may be used in metal housings such as titanium. In addition,
more than one strain indicator 107 may be strategically mounted
within the mobile station housing 10A. The principles of resistive
strain gauge sensors and piezo-electric crystals are well known
and need not be discussed here.
In alternate embodiments, the PCB may have a PCB strain gauge 108
mechanically coupled or epoxy bonded to the PCB. In alternate embodiments,
more than one PCB may have one or more strain gauges mechanically
attached (see FIG. 3).
The method steps for determining body strain and PCB strain are
shown in FIG. 6A. Steps 6A1 and 6A4 measure body strain and PCB
strain, respectively. Step 6A6 sounds an alarm and step 6A3 stores
the sensed value(s) in memory if either step 6A2 or step 6A5 determines
that the strains exceed a predetermined threshold.
Referring also to FIG. 2, the MS also includes circuitry 105 for
receiving a signal from the strain gauge indicator(s) 107,108. Also
shown in FIG. 2 are exemplary alarm indicators such as light circuits
L.sub.1,L.sub.2 and vibration unit V, used together or separately,
to alert a user when a predetermined strain is about to be exceeded
or when strain has exceeded a predetermined threshold. Similarly,
the display 20 could also be used to alert the user when a predetermined
strain is about to be exceeded or when strain has exceeded a predetermined
threshold.
Referring to FIG. 4, in one embodiment, circuitry 105 may include
an electric circuit 105A that is capable of measuring small changes
in resistance corresponding to strain placed upon the mobile phone
housing, such as, for example, a Wheatstone bridge. The strain gauge
circuit shown in FIG. 4 shows one body strain gauge 107 and one
PCB strain gauge in the electric circuit 105A. Resistors R.sub.1
and R.sub.2 may be any suitable resistor. Wheatstone bridges are
well known and need not be discussed here. The output voltage of
the Wheatstone bridge is generally expressed in millivolts output
per volt input (i.e., high sensitivity). Alternate embodiments may
use any suitable type of electric circuit, such as a Chevron bridge,
or a four wire ohm circuit. In embodiments using a piezo-electric
crystal (FIG. 2, item Pz), a less sensitive buffer amplifier circuit
(FIG. 2, item 105B) may be used.
In embodiments using a circuit 105A, such as the Wheatstone bridge,
and resistive strain gauge(s) (FIG. 3, items R.sub.gpc and/or Rg.sub.body),
the amount of stress placed on the mobile phone housing may be determined
to within a very small resolution. The output of the electric circuit
105 may be used to drive the speaker (FIG. 2, item 17) with a predefined
alarm tone or sound pattern when the mobile phone housing (FIG.
1, item 10A) is experiencing strain. In addition the output of the
electric circuit 105A may be digitally stored in memory (FIG. 2,
item 24) for later retrieval and analysis.
It will be appreciated that the low level of the strain signal
makes it particularly subject to unwanted interference from other
electrical components or external devices. For example, transmitting
components within the mobile phone are potential error sources in
the strain measurement circuit. Another error source may include
magnetically induced voltages. The sum of such interferences can
result in degradation of the strain measurement and therefore suitable
shielding is preferably used, at least around the strain transducer
and bridge circuits.
The electric circuit 105A may be adjusted to only sound an alarm
when mobile phone housing strain exceeds a certain manufacture determined
threshold strain value the threshold value or values are preferably
stored in the memory 24.
Referring to FIG. 5 there is shown an alternate embodiment of the
present invention incorporating strain sensing features within,
or on, a printed circuit PCB. In this embodiment, the aforementioned
strain indicators may be bonded to (i.e., external) or within (i.e.,
internal) the PCB. Similar to the above description, the external
and/or internal strain indicators P.sub.zpc and R.sub.gpc may be
used to indicate when, and how much strain a PCB is experiencing.
It will be appreciated, that in certain embodiments the sensors
may be arranged in individual sensing circuits or grouped together
in a sensing circuit, similar to FIG. 4. When the PCB strain exceeds
a predetermined value (i.e., a manufacturer-specified value) an
alarm may be sounded though the mobile phone speaker as well as
storing the value in memory 24 for later retrieval and analysis.
The PCB strain indicators P.sub.zpc and R.sub.gpc may be bonded
to the PCB or embedded within the PCB during PCB manufacture as
illustrated in FIG. 5. For example, sputter deposited thin-metal-film
gauges could be deposited within the (multi-layer) circuit board.
This would have the advantage of a bonded strain indicator but without
the disadvantage of strain coupling loss through the bonding material.
In alternate embodiments the electric circuit 105 (or circuits)
may signal a warning tone proportionate to the sensed strain and
another, more urgent tone, when the PCB strain is about to be exceeded.
The same technique can be used for the housing strain sensor(s).
In addition, retrieval and comparison of strain values can be used
to differentiate misuse or manufacturing defects.
Also, in alternate embodiments where resistive strain gauges are
used for both the mobile phone housing 10A strain indicator 107
and the PCB strain indicator 108, the resistive strain gauges may
be combined in one Wheatstone bridge configuration as shown in FIG.
4. It will be appreciated that such a configuration effectively
combines housing strain and PCB strain as sensed by the housing
strain indicator and the PCB strain indicator, respectively; which
then may then be compared to a predetermined aggregate value. The
method steps for determining combined body strain and PCB strain
are shown in FIG. 6B. Steps 6B1 and 6B2 measure body strain and
PCB strain, respectively. Step 6B5 sounds an alarm and step 6B4
stores the sensed value(s) in memory if step 6B3 determines that
the aggregate strains exceed a predetermined threshold.
It should be understood that the foregoing description is only
illustrative of the invention. Various alternatives and modifications
may be devised by those skilled in the art without departing from
the invention. For example, in alternate embodiments, the experienced
strain value, or values, may be uploaded over a control link to
the BS for analysis and/or historical information regarding mobile
phone strain. Alternatively, in alternate embodiments, the strain
experienced by either the mobile phone housing or the mobile phone
PCB may be stored in memory 24 along with a time stamp for later
strain analysis. This information may be used optimize manufacturing
designs and/or techniques. |